Physical Vapour Deposition (PVD) system with three magnetrons

Physical vapour deposition system is designed for the deposition of metallic, semiconductive and oxide thin films/membranes synthesis using magnetron sputtering technique.

• 304L Stainless Steel chamber (75 L volume) with large door opening (approximately 350×600 mm) and multiple customisable ports (2.75 CF) for attachment of various additional components and feedthroughs;
• Oil free high vacuum (up to 10-8 mbar) achievable by 1500 L/s cryopump;
• 3-position pneumatically actuated isolation gate valve for adjustment of pumping speed during deposition process;
• Fully integrated computer control of gas supply (two independent MFC), pumping/venting processes, pneumatic valves and safety system.
• Three flexible head 3 inch diameter magnetrons with exchangeable target material disks. Magnetron sputtering can be position top-down or bottom-up;
• Wide selection of power supplies for magnetrons: 500 W and 1000 W DC power supplies with additional unit to make them operate in 2-20 kHz pulsed DC mode, 300 W RF power supply;
• Large area (approximate diameter 300 mm) and heat capacity sample holder disk;
• Sample heater system design to heat the backside of substrate fixture and supplied with thermocouple feedback and control of temperature up to 300 °C.